在光通訊模組構裝中，為求快速及大量生產，多採被動式對準，造成二極體雷射與光纖間耦合率降低，而當使用主動式對準來提升耦合率時，若以雷射銲接接合，則易產生銲後位移造成耦合率下降，並且由於雷射銲接設備價格高昂，造成構裝成本不易降低。

　　本論文使用電子構裝中成熟的錫銲構裝技術，替代雷射銲接，藉以大幅降低構裝成本。論文中先進行光場分析並量測雷射與光纖耦合特性，接著使用自行設計的彈性化光纖載具與微夾具，進行主動式對準的微調定位，使雷射與光纖間具有最大光功率耦合率，然後在接合實驗中，藉由控制操作環境來預估錫銲固化所造成固定偏移量，最後在接合前預先補償偏移量，再以錫銲固定光纖載具完成元件構裝。

　　由實驗結果可知，經補償後的錫銲構裝，雷射與光纖之間的最大偏移量可以保持在1㎛ 以內，符合耦合率損失低於3dB的性能要求，因此本研究設計之光纖載具可使用於主動式光對準自動化製程，減少雷射與光纖間耦合率損失，且因使用銲錫構裝技術，未來可以改採表面黏著技術，預計將更大幅降低構裝成本。

In the fiber-optic modules packaging, the passive alignment can provide mass production, but it also results in low Electro-Optic performance. After using active alignment in packaging, the laser welding is often applied to assemble the module. However, the welding process cause a post-weld-shift (PWS) of fiber. And the laser welding machine is expensive, this will make the module packaging price hard to cost down.

A major cost-reduction soldering fixing technique is developed to replace the laser welding. To determine the fabrication tolerances associated with the coupling of a laser diode and a single-mode fiber(SMF), the sensitivity of the coupling efficiency in both linear and angular offsets was measured. In this research, a fiber holder and a gripper have been developed for assembly. And active alignment is used to align the laser diode and SMF under computer control, whereupon a soldering fixing operation joins the fiber holder on the module. During the soldering process, the condition control was provided to keep the deflection steady. After the displacement compensating before soldering, the final displacement is less than 1 ㎛ which keeps the coupling loss within 3dB.

目錄...................................................................................V
圖目錄...............................................................................VII
表目錄................................................................................IX
中文摘要...............................................................................X
英文摘要..............................................................................XI
第一章 序論............................................................................1
　1.1 研究背景.........................................................................1
　1.2 研究動機與目的...................................................................1
第二章 文獻回顧........................................................................2
　2.1 光對準的必要性...................................................................4
　2.2 光對準的方式.....................................................................5
　2.3 主動式對準技術...................................................................7
第三章 研究方法.......................................................................10
　3.1 光纖載具設計....................................................................10
　3.2 耦合率分析......................................................................11
　3.3 載具與基板的接合................................................................15
第四章 實驗...........................................................................20
　4.1 實驗配置........................................................................20
　　4.1.1 載具夾持機構................................................................21
　　4.1.2 運動定位平台................................................................22
　　4.1.3 雷射控制設備................................................................22
　　4.1.4 取像對準設備................................................................24
　　4.1.5 載具錫銲設備................................................................25
　　4.1.6 定位控制程式................................................................25
　4.2 耦合率與偏移量關係量測..........................................................26
　4.3 構裝流程........................................................................32
　4.4 錫銲溫度控制....................................................................33
　4.5 錫銲後偏移量量測................................................................35
第五章 討論與結論.....................................................................38
參考文獻..............................................................................40

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